2. ´õ ¾ÈÁ¤Àû
TTC ¼Óµµ ½Ç¹ö ¸¶³à´Â ÀÚÀ¯ »óÅ»Ӹ¸ ¾Æ´Ï¶ó Æ®¸®°Å »óÅ¿¡¼µµ TTC ¾ç¸é ¹æÁø º® ƯÇã ±â¼ú (CN201620103314.9) ±¸Á¶¸¦ äÅÃÇÕ´Ï´Ù. ±×°ÍÀº Ç×»ó ¹ÙÀ§Ã³·³ ¾ÈÁ¤ÀûÀÔ´Ï´Ù.
3. ´õ ¾ÈÁ¤ÀûÀÎ
1) Ãʱ⠾з Áõ°¡
Ãʱ⠾зÂÀº ½ºÀ§Ä¡°¡ ÀÛµ¿ è¹ö¸¦ ½ÃÀÛÇϱâÀ§ÇÑ ÃÖ¼Ò ÀÓ°èÁ¡ ¾Ð·ÂÀÔ´Ï´Ù. ÀÓ°èÁ¡ÀÌ ³Ê¹« ³· À¸¸é °¡º¿î ¾Ð·Â°ú À߸øµÈ Á¢ÃËÀÌ ºÒ°¡ÇÇÇÕ´Ï´Ù. ÀÌ·¯ÇÑ ÀÌÀ¯·Î TTC´Â ±âÁ¸ÀÇ ½Ç¹ö ½ºÀ§Ä¡ 30GF ¿¡¼ ½ÃÀÛ ÀÓ°èÁ¡ÀÇ ÃÖ¼Ò ¾Ð·ÂÀ» 39GF ·Î Áõ°¡½ÃÄÑ À߸øµÈ ÅÍÄ¡ÀÇ À§ÇèÀ» Å©°Ô ÁÙÀÌ¸ç ±× È¿°ú´Â ¸Å¿ì Áß¿äÇÕ´Ï´Ù.
2) Àüµµ·ÂÀÇ ÇÏÇÑÀ» Áõ°¡
TTC°¡ Ư¡ ÀÎ ÀÌÁß ±ä ½ºÇÁ¸µ ±¸Á¶ ¼³°è¸¦ äÅÃÇÔÀ¸·Î½á ½ºÇÁ¸µ ·ÂÀÇ Á¤È®µµ°¡ Çâ»óµÇ°í ¸®¹Ù¿îµå¸¦ ÃÖÀûÈÇÏ´Â Á¶°Ç¿¡¼ ¸®¹Ù¿îµå°¡ °¨¼ÒÇÕ´Ï´Ù.
¾Ð·Â °øÂ÷, ÀüÅëÀûÀÎ ½Ç¹ö ½ºÀ§Ä¡ Àüµµ ¾Ð·ÂÀÇ ÇÏÇÑÀº 30GF (45 +-15GF) ¿¡¼ 41GF (45 +-4GF) ·Î Áõ°¡µÇ¾î 36% Áõ°¡ÇÕ´Ï´Ù. µû¶ó¼ ¼Õ°¡¶ôÀÇ °¡º¿î ÅÍÄ¡·Î ÀÎÇÑ À߸øµÈ ÅÍÄ¡ÀÇ ±âȸ°¡ Å©°Ô ÁÙ¾îµé°í ±× È¿°ú´Â Áï°¢ÀûÀÔ´Ï´Ù.
3) Àüµµ ³úÁ¹ÁßÀÇ ÇÏÇÑÀ» ´Ã¸®½Ê½Ã¿À
À߸øµÈ Á¢ÃËÀÇ °¡´É¼ºÀ» ´õ ÁÙÀ̱â À§ÇØ, TTC´Â ÀÌ·ÐÀû ÇÏÇÑ Àüµµ ÇàÁ¤À» 0.88MM(1.08 + 0.4/-0.2MM) À¸·Î Áõ°¡ ½ÃÄ×½À´Ï´Ù. ¿¡¼ ÀüÅëÀûÀÎ ½Ç¹ö ½ºÀ§Ä¡ 0.8MM(1.2 +-0.4MM) , ¹üÀ§¸¦ 10% ´Ã¸®½Ê½Ã¿À. µû¶ó¼ °ÅÁþ¿¡ ÀÇÇÑ °¡º¿î ÅÍÄ¡ È®·üÀ» ÁÙÀÔ´Ï´Ù.
4) ħÅõ¸¦ ¾ö°ÝÈ÷ ¹æÁö
±Ý¼Ó ´ÜÀÚ¿Í ÇÏ¿ì¡ »çÀÌ¿¡ °¸ÀÌ Àֱ⠶§¹®¿¡ ½ºÀ§Ä¡¿Í PCB´Â ¿þÀÌºê ³³¶«µÇ¾î ÀÖ½À´Ï´Ù. Á¦¾î°¡ ÁÁÁö ¾ÊÀ¸¸é ·ÎÁø ¹× ·ÎÁø Áõ±â°¡ °¸¿¡¼ ½ºÀ§Ä¡·Î µé¾î°¥ ¼ö ÀÖ½À´Ï´Ù. ½ºÀ§Ä¡ÀÇ ±Ý Á¢Á¡ À§Ä¡ ºÙ¾î ÀÖÀ¸¸é Á¢ÃË ºÒ·® ¹ß»ýÇÕ´Ï´Ù.
ÁÖ¼®·Î¸¦ Åë°ú ÇÒ ¶§ Áõ±â°¡ ½ºÀ§Ä¡·Î ħÅõÇÏ´Â °ÍÀ» ¹æÁöÇϱâ À§ÇØ, TTC´Â »þÇÁÆ®°¡ 100% ¾ÈÁ¤ÀûÀÌ°í ¾ÈÀüÇÏ´Ù´Â °ÍÀ» º¸ÀåÇϱâ À§ÇØ »þÇÁÆ® Àüµµ¼º Dz ¹× º£À̽º¿Í ÇÔ²² Á¢ÂøÁ¦°¡ ÷°¡µÈ Åõ°ú ¹æÁö °øÁ¤À» °³Ã´Çß½À´Ï´Ù.
10pcs TCC ¼Óµµ ½Ç¹ö ½ºÀ§Ä¡ ±â°è½Ä
¿ì¸®´Â ´ç½ÅÀÇ ÁÖ¹®À» °ü½É
3. More reliable
1) Increase initial pressure
The initial pressure is the minimum critical point pressure for the switch to start the working chamber. If the critical point is too low, light pressure and false touches are inevitable. For this reason, TTC increase the minimum pressure of the starting critical point to 39GF from the traditional silver switch 30GF,which greatly reduces the risk of false touches, and the effect is very significant.
2) Increase the lower limit of conduction force
By adopting the TTC-featured double long spring structure design, the accuracy of spring force is improved, and the rebound is reduced under the condition of optimizing the rebound.
Pressure tolerance, the lower limit of the traditional silver switch conduction pressure is increased from 30GF (45+-15GF) to 41GF (45+-4GF), an increase of 36%.Thereby, the chance of false touch caused by the light touch of the finger is greatly reduced, and the effect is immediate.
3) Increase the lower limit of conduction stroke
In order to further reduce the probability of false touches, TTC increased the theoretical lower limit conduction stroke to 0.88MM(1.08+0.4/-0.2MM) from from traditional silver switch 0.8MM(1.2+-0.4MM) ,Increase the range by 10%.Thereby reducing the probability of light touch by false .
4) Strictly prevent infiltration
Because there is a gap between the metal terminal and the housing, switch and PCB are wave soldered, if the control is not good, the rosin and rosin vapor may enter the switch from the gap. If it is stuck to the position of the gold contact on switch , will occure poor contact .
In order to prevent the vapor from penetrating into the switch when passing through the tin furnace, TTC pioneered the use of glue-added anti-permeation process with the shaft conductive foot and the base to ensure that the shaft is 100% reliable and safe.
Specfication
This Listing Include:
10pcs TTC Speed Silver Switch Mechanical
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